Nanchip Technology’s convertible bonds not exceeding 1.59 billion yuan approved by the Shanghai Stock Exchange; CITIC Jianhui JIAngong

2026-04-12 06:46:10

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China Economic Net, Beijing, April 2 (News): According to information from the Shanghai Stock Exchange, the 14th deliberation meeting of the Shanghai Stock Exchange Listing Review Committee for 2026 was held on April 1, 2026. Shanghai Nanchip Semiconductor Technology Co., Ltd. (.SH) meets the issuance requirements, the listing requirements, and the information disclosure requirements.

Main questions asked at the Listing Committee meeting

Please ask the issuer’s representative to explain whether there are any material uncertain risk(s) in the implementation of this fund-raising project, taking into account the research and development progress of the products corresponding to this fund-raising project, the market competition landscape, competitive strengths and weaknesses, downstream customers, and the expansion of target markets, etc. Please have the sponsor representative give a clear opinion.
Please ask the issuer’s representative to, in light of the circumstances of investing in private funds, explain whether there are any situations that would infringe upon the interests of the listed company. Please have the sponsor representative and the accountant give clear opinions.

Further matters to be implemented

None.

The sponsor institution of Nanchip Technology (.SH).SH( is CITIC Securities Co., Ltd., and the sponsor representatives are Zhou Yang and Jia Xinghua.

On January 16, Nanchip Technology disclosed the “Submission Draft of the Securities Offering Memorandum for the Public Issuance of Convertible Corporate Bonds to Unspecified Targets ).SH”. The total amount of proceeds to be raised from this public issuance of convertible corporate bonds to unspecified targets will not exceed 158,688.11 million yuan (including this amount). The net proceeds after deducting issuance expenses will be used for the R&D and industrialization project of power management chips in the intelligent computing power field, the R&D and industrialization project of automotive chips, and the R&D and industrialization project of sensing and control chips for industrial applications.

The type of securities to be issued in this offering is convertible corporate bonds that can be converted into the company’s A-share stock. These A-share convertible corporate bonds and the company’s A-share stock that will be converted in the future will be listed on the STAR Market of the Shanghai Stock Exchange.

The proposed number of convertible bonds to be issued will not exceed 15,868,811 lots (including this number). The issuance size will be no more than 158,688.11 million yuan (including this amount). The specific issuance size will be determined within the above-mentioned quota range by the company’s shareholders’ meeting authorizing the board of directors, or by the board of directors authorizing relevant persons. Each convertible bond in this offering has a face value of 100 yuan RMB, and will be issued at par value.

The total amount of proceeds expected to be raised from this convertible bond issuance will not exceed 158,688.11 million yuan (including this amount). The net proceeds will be determined after deducting issuance expenses.

The specific method of issuance of these convertible bonds will be negotiated and determined by the board of directors or authorized persons of the company and the sponsor (lead underwriter), as authorized by the shareholders’ meeting, in accordance with relevant provisions of laws and regulations.

The issuance targets of these convertible bonds are natural persons, legal persons, securities investment funds, and other investors that comply with legal requirements and hold securities accounts with the Shanghai Branch of China Securities Depository and Clearing Co., Ltd. (excluding those prohibited by national laws and regulations).

The term of the convertible corporate bonds issued in this offering is six years from the date of issuance.

The method for determining the coupon rate of the convertible corporate bonds and the final interest rate level for each interest year will be determined before issuance by the board of directors of the company (or authorized persons), authorized by the shareholders’ meeting, through consultation with the sponsor (lead underwriter) based on national policies, market conditions, and the company’s specific circumstances.

Editor: Wei Jingting

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