Micron Reveals HBM4, SOCAMM2 Memory and 9650 SSD Storage in Simultaneous Mass Production, Optimized for NVIDIA Vera Rubin Platform

IT Home, March 17 — During the NVIDIA GTC GPU Technology Conference held early this morning, Micron announced that several of its storage products have entered large-scale mass production, all designed around the NVIDIA Vera Rubin platform.

Micron stated that its HBM4 production line began mass production and shipment in the first quarter of this year. The initial products are 36GB 12-high stacked versions, specifically built for the Vera Rubin platform. These products have pin speeds exceeding 11Gb/s and can provide over 2.8TB/s of memory bandwidth, approximately 2.3 times faster than the previous generation HBM3E, with more than 20% improvement in power efficiency.

Additionally, Micron revealed that it has provided early samples of 48GB HBM4 with 16-high stacking to customers. Compared to the 12-high version, this model offers a 33% increase in single-chip capacity, further enhancing the available memory capacity per HBM module.

Micron also announced that its SOCAMM2 memory modules have entered large-scale mass production. The 192GB capacity version will be used in the Vera Rubin NVL72 system and the standalone Vera CPU platform. These modules can provide up to 2TB of memory per CPU and 1.2TB/s bandwidth. The entire SOCAMM2 product line ranges from 48GB to 256GB to meet various AI server configuration needs.

In storage products, Micron announced that its Micron 9650 SSD has officially entered mass production. This data center SSD uses PCIe Gen6 interface and is the industry’s first SSD specifically optimized for NVIDIA BlueField-4 STX architecture.

Regarding specifications, the Micron 9650 offers sequential read speeds of up to 28GB/s and random read performance of 5.5 million IOPS, nearly doubling the read performance of the previous generation PCIe Gen5 SSD. At the same time, its performance-per-watt has also approximately doubled.