Kang Da New Material: The company's cerium oxide polishing liquid (CMP) project is currently striving to deliver samples to target customers by the end of April according to the planned schedule.

NightAirdropper · 2026-03-19T05:30:08+00:00

Kangda New Materials stated in the research that CMP polishing slurry is a key material in semiconductor manufacturing, with plans to send samples to customers before the end of April. Subsequently, the company will optimize the product based on feedback and achieve small-scale production.

NightAirdropper

2026-03-19 05:30:08

Abstract generation in progress

Securities Daily, March 16 — Kangda New Materials stated during a survey that CMP polishing liquid is a material used in the chemical mechanical polishing (Chemical Mechanical Polishing, abbreviated CMP) process in semiconductor manufacturing. As one of the company’s core areas in the semiconductor materials sector, it forms part of the inorganic semiconductor materials business matrix alongside ITO target materials, alumina target materials, and low-temperature co-fired ceramics (LTCC). Currently, the company’s cerium oxide polishing liquid (CMP) project is on track to deliver samples to target customers by the end of April. By 2026, the company plans to optimize the product based on customer feedback and achieve small-scale production.

(Editor: Ren Shibi)

View Original

This page may contain third-party content, which is provided for information purposes only (not representations/warranties) and should not be considered as an endorsement of its views by Gate, nor as financial or professional advice. See Disclaimer for details.