Bomin Electronics: Termination of Investment in Bomin Ceramic Substrate and IC Packaging Substrate Industrial Base Project

People’s Financial News, March 17 — Bomin Electronics (603936) announced on March 17 that the company previously signed an “Investment Agreement” with the Hefei Economic Development Zone Management Committee, planning to invest in the Bomin Ceramic Lining Plate and IC Packaging Substrate Industry Base Project within the development zone. The company also established a wholly-owned subsidiary, Bori Zhi Xin. As of the announcement date, Bori Zhi Xin’s registered capital has not yet been paid in, and no actual business operations have been conducted. The company’s “Bomin Electronics Next-Generation Electronic Information Industry Investment Expansion Project (Phase I)” in Meizhou is progressing smoothly. The total investment is 3 billion yuan. Once fully operational, it will have the capacity to produce high-end PCB products such as high-multilayer boards, HDI boards, and special boards, which can fully meet the company’s future 2-3 years of additional order demands and effectively support the company’s business development plan. The company sent a confirmation letter to the external investment partner, Hefei Economic Development Zone Management Committee, to formally communicate and negotiate regarding the termination of the project. On March 16, 2026, the company officially received a reply from the Hefei Economic Development Zone Management Committee, and all parties reached a consensus on terminating this external investment and decided to cancel the wholly-owned subsidiary, Bori Zhi Xin.