Moore Threads, in collaboration with China Mobile Research Institute and others, releases the reference design for 128-card high-density super nodes.

People’s Financial News, March 16 — According to Mooresoft, recently, relying on the OISA Collaborative Innovation Platform, Mooresoft, China Mobile Research Institute, Zhijiang Laboratory, and other industry partners officially released the “OISA High-Density Super Node Reference Design Technical Specification.” This specification addresses current bottlenecks in interconnectivity, power supply pressure, and heat dissipation limits faced by intelligent computing centers, proposing a full-stack solution that lays a key technological foundation for building autonomous, controllable, high-performance intelligent computing clusters. In the physical layout and logical topology of intelligent computing centers, the OISA high-density super node achieves a deep reconstruction of spatial density and expansion dimensions, breaking through the traditional architecture’s computing power growth barriers. The technical specification boldly introduces large-dimension high-density cable solutions, enabling full interconnection of 128 cards within a standard single-width cabinet based on mainstream 32- to 64-card interconnects, and supporting expansion through cabinet stacking to deploy 256 cards, greatly optimizing computing power output per unit land area.